Emerson PACSystems RXi2-BP Industrial PC

The Emerson PACSystems RXi2-BP industrial PC delivers compact, rugged, mid- to high-range performance computing capabilities to run HMI, historian, and analytics applications right at the machine to enable improved real-time control of operations and better integration into plant-wide systems. The RXi2-BP IPC uses the latest AMD Ryzen family of processors and has up to 16GB of ECC RAM, four to six Gigabit Ethernet interfaces, and industrial-grade high-speed SSD disc storage. These features make it the perfect platform for running industrial applications even in the harshest environments. The RXi2-BP design features optional mini PCIe and 1- or 2-slot PCIe expandability. To help keep data and operations secure, the RXi2-BP uses Trusted Platform Module (TPM) and Microsoft Secure Boot technology. The RXi2-BP can be optionally pre-loaded with Emerson’s PACEdge or Movicon. Based on OPC UA, Movicon.NExT is the first integrated automation software platform for connectivity, IIoT, machine HMI, HMI/SCADA and plant analytics. Movicon.NExT enables connectivity to many native and integrated communication protocols. It provides enhanced visualization tools, including WPF, XAML and 3D graphics, and also enables data recording independent of data format used. With Movicon.NExT, users also get integrated scripting, an alarm management system, and analytics capable of acquiring production data in real time. These analytics provide KPI and OEE performance data, calculate machine downtime and can be used in tracking and scheduling production. PACEdge is a singular, secure, and controlled environment for users to begin their Digital Transformation. Edge processing maximizes the value of data so the user can generate real insights and improve their operation’s reliability, safety, and energy optimization. PACEdge provides the foundation for these improvements by delivering all aspects of edge processing with simplified IIoT application development, deployment, and administration. All components necessary in the IIoT application life cycle are brought together in this single package to provide a unified and secure interface to decrease development time and increase deployable footprint. All aspects of the RXi2-BP IPC have been engineered for reliability in harsh environments. The RXi2-BP IPC architecture is Emerson PACSystems’ rugged COM Express modular CPU platform. Emerson incorporates patented thermal monitoring technology with sophisticated passive cooling techniques to provide the highest-performance, fanless industrial computing platform that can operate in extended temperature ranges in both commercial and industrial applications.